Features:

  • Maximum thermal conductivity To provide the best thermal interface and achieve ultra-efficient heat transfer from CPU, GP and Chipset in mission critical applications.
  • Ultra-durable and non-hardening stable performance in a wide temperature range, ranging from -30 to 150 C
  • Ensuring maximum conductivity GC-4 comes with micron particle synthetic thermal filler and polymer matrix to withstand maximum conductivity. perfect gap filling and optimal viscosity.

Details: Maximum thermal conductivity To provide the best thermal interface and achieve ultra-efficient heat transfer from CPU, GP and Chipset in mission critical applications. Stable performance in a wide temperature range, ranging from -30 to 150 C Ensuring maximum conductivity GC-4 comes with micron particle synthetic thermal filler and polyer matrix to withstand maximum conductivity. perfect gap filling and optimal viscosity.

Gelid Solutions

Gelid Solutions GC-4 Thermal Compound for Heat Sinks | Maximum thermal conductivity | Easy to use | Non-corrosive

SKU TC-GC-04-A
€5,00

 

Features:

  • Maximum thermal conductivity To provide the best thermal interface and achieve ultra-efficient heat transfer from CPU, GP and Chipset in mission critical applications.
  • Ultra-durable and non-hardening stable performance in a wide temperature range, ranging from -30 to 150 C
  • Ensuring maximum conductivity GC-4 comes with micron particle synthetic thermal filler and polymer matrix to withstand maximum conductivity. perfect gap filling and optimal viscosity.

Details: Maximum thermal conductivity To provide the best thermal interface and achieve ultra-efficient heat transfer from CPU, GP and Chipset in mission critical applications. Stable performance in a wide temperature range, ranging from -30 to 150 C Ensuring maximum conductivity GC-4 comes with micron particle synthetic thermal filler and polyer matrix to withstand maximum conductivity. perfect gap filling and optimal viscosity.
€5,00
Size:

Descrizione prodotto

 

Features:

  • Maximum thermal conductivity To provide the best thermal interface and achieve ultra-efficient heat transfer from CPU, GP and Chipset in mission critical applications.
  • Ultra-durable and non-hardening stable performance in a wide temperature range, ranging from -30 to 150 C
  • Ensuring maximum conductivity GC-4 comes with micron particle synthetic thermal filler and polymer matrix to withstand maximum conductivity. perfect gap filling and optimal viscosity.

Details: Maximum thermal conductivity To provide the best thermal interface and achieve ultra-efficient heat transfer from CPU, GP and Chipset in mission critical applications. Stable performance in a wide temperature range, ranging from -30 to 150 C Ensuring maximum conductivity GC-4 comes with micron particle synthetic thermal filler and polyer matrix to withstand maximum conductivity. perfect gap filling and optimal viscosity.

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Total price €39,00

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